Organic light-emitting display apparatus and method of manufacturing the same

ABSTRACT

Provided are an organic light-emitting display apparatus and a method of manufacturing the same. The organic light-emitting display apparatus includes a first substrate; an organic light-emitting device provided on the first substrate and including a first electrode, a second electrode, and an intermediate layer positioned between the first electrode and the second electrode; a second substrate covering the organic light-emitting device and disposed to face the first substrate; and a sealant bonding the first substrate and the second substrate, wherein at least a portion of the sealant is a intermixing region which is formed as an inorganic material permeates an organic material.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/990,518, filed May 25, 2018, which is a divisional of U.S. patentapplication Ser. No. 15/644,305, filed Jul. 7, 2017, now U.S. Pat. No.9,985,242, which is a continuation of U.S. patent application Ser. No.14/724,500, filed May 28, 2015, now U.S. Pat. No. 9,728,740, whichclaims priority to Korean Patent Application No. 10-2014-0174263, filedon Dec. 5, 2014, in the Korean Intellectual Property Office, the entirecontents of both of which are incorporated herein by reference.

BACKGROUND

1. Field

The disclosure relates to an apparatus and a method, and moreparticularly, to an organic light-emitting display apparatus and amethod of manufacturing the same.

2. Description of the Related Technology

Generally, an organic light-emitting display apparatus has excellentfeatures as an active light-emitting type display device. For example,the organic light-emitting display apparatus not only has a wide viewingangle and a high contrast ratio but also may be driven at a low voltage.Furthermore, the organic light-emitting display apparatus is thin andlightweight and has a fast response time. Accordingly, the organiclight-emitting display apparatus is being noted as a next-generationdisplay device.

Such a light-emitting device is divided into an inorganic light-emittingdevice and an organic light-emitting device according to a material ofan emission layer of the light-emitting device. The organiclight-emitting device has better features in terms of luminance,response time, and the like than the inorganic light-emitting device andenables color display. Thus, development of the organic light-emittingdevice is in active progress recently.

The organic light-emitting device may be degraded due to permeation ofexternal oxygen and moisture. Accordingly, the organic light-emittingdevice should be protected from the permeation of external oxygen andmoisture in order to improve reliability. To solve the problem, researchon a method of sealing the organic light-emitting device by using aninorganic material sealant such as a frit is in progress. However, sucha frit encapsulation structure damages the organic light-emitting devicebecause a high-temperature bonding process is required to cure the frit,is unfavorable for a substrate having a large area because it takesconsiderable time to irradiate laser, and degrades the device integrity.

SUMMARY

One or more exemplary embodiments include an organic light-emittingdisplay apparatus and a method of manufacturing the same.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to some embodiments, an organic light-emitting displayapparatus includes a first substrate; an organic light-emitting deviceprovided on the first substrate and including a first electrode, asecond electrode, and an intermediate layer positioned between the firstelectrode and the second electrode; a second substrate covering theorganic light-emitting device and disposed to face the first substrate;and a sealant bonding the first substrate and the second substrate,wherein at least a portion of the sealant is a intermixing region whichis formed as an inorganic material permeates an organic material.

The sealant may have the intermixing region formed by filling freevolume of the organic material with the inorganic material.

The organic material may be formed of one or more materials selectedfrom the group consisting of an acrylate-based resin, amethacrylate-based resin, polyisoprene, a vinyl-based resin, anepoxy-based resin, a urethane-based resin, a cellulose-based resin, anda parylene-based resin.

The inorganic material may be formed of one or more materials selectedfrom the group consisting of silicon nitride, aluminum nitride,zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride,silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide,and silicon oxynitride.

The intermixing region may be formed as the inorganic material permeatesthe organic material through sequential vapor infiltration (SVI).

A thickness of the intermixing region may be less than a thickness of anorganic film formed by the organic material.

The intermixing region may be formed on the outside of the sealant.

A volume of the inorganic material per unit volume of the sealant maydecrease in a direction from an outermost perimeter of the organiclight-emitting display apparatus to the inside of the organiclight-emitting display apparatus.

According to some embodiments, an organic light-emitting displayapparatus includes a first substrate; an organic light-emitting deviceprovided on the first substrate and including a first electrode, asecond electrode, and an intermediate layer positioned between the firstelectrode and the second electrode; a second substrate covering theorganic light-emitting device and disposed to face the first substrate;and a first sealant and a second sealant bonding the first substrate andthe second substrate and disposed to face each other, wherein at leastone of the first sealant and the second sealant includes a intermixingregion formed as an organic material is partially permeated by aninorganic material.

The first sealant may have a first intermixing region formed by fillingfree volume of a first organic material with a first inorganic material,and the second sealant may have a second intermixing region formed byfilling free volume of a second organic material with a second inorganicmaterial.

At least one of the first intermixing region and the second intermixingregion may be formed by using sequential vapor infiltration (SVI).

Each of the first organic material and the second organic material maybe formed of one or more materials selected from the group consisting ofan acrylate-based resin, a methacrylate-based resin, polyisoprene, avinyl-based resin, an epoxy-based resin, a urethane-based resin, acellulose-based resin, and a parylene-based resin.

Each of the first inorganic material and the second inorganic materialmay be formed of one or more materials selected from the groupconsisting of silicon nitride, aluminum nitride, zirconium nitride,titanium nitride, hafnium nitride, tantalum nitride, silicon oxide,aluminum oxide, titanium oxide, tin oxide, cerium oxide, and siliconoxynitride.

The first intermixing region and the second intermixing region may facethe outside of the organic light-emitting display apparatus.

The first intermixing region may be formed toward the organiclight-emitting device, and the second intermixing region may be formedtoward a perimeter of the organic light-emitting display apparatus.

According to some embodiments, a method of manufacturing an organiclight-emitting display apparatus includes preparing a first substrate onwhich an organic light-emitting device is formed; and covering theorganic light-emitting device by bonding the first substrate and asecond substrate with a sealant, wherein the sealant is formed by usingsequential vapor infiltration (SVI) such that an inorganic materialpermeates an organic material.

The sealant may be disposed in a chamber, and the inorganic material maybe injected as a gas into the chamber and may spread through free volumeof the organic material.

The inorganic material may have a source gas spreading through the freevolume of the organic material and a reactive gas spreading through thefree volume of the organic material thereafter and reacting with thesource gas.

BRIEF DESCRIPTION OF THE DRAWINGS

The patent or application file contains at least one drawing executed incolor. Copies of this patent or patent application publication withcolor drawings will be provided by the Office upon request and paymentof the necessary fee. These and/or other aspects will become apparentand more readily understood from the following description of theexemplary embodiments, taken in conjunction with the accompanyingdrawings in which:

FIG. 1 is a front view of an organic light-emitting display apparatusaccording to an embodiment;

FIG. 2 is a cross-sectional view in which an area A of FIG. 1 isenlarged;

FIG. 3 is a cross-sectional view of an organic light-emitting device ofFIG. 1;

FIG. 4 is a front view of an organic light-emitting display apparatusaccording to another embodiment; and

FIG. 5 is a block diagram for describing a method of manufacturing asealant of FIG. 1.

DETAILED DESCRIPTION

As the disclosure allows for various changes and numerous embodiments,exemplary embodiments will be illustrated in the drawings and describedin detail in the written description. The effect and feature of thedisclosure and methods of accomplishing the same will become apparentfrom the following description of the exemplary embodiments in detail,taken in conjunction with the accompanying drawings. The disclosure may,however, be embodied in many different forms and should not be construedas limited to the exemplary embodiments set forth herein.

While such terms as “first” and “second” may be used to describe variouscomponents, such components must not be limited to the above terms. Theabove terms are used only to distinguish one component from another.Also, the singular forms “a,” “an,” and “the” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will be understood that the terms such as “include,”“comprise,” and “have” used herein specify the presence of statedfeatures or components, but do not preclude the presence or addition ofone or more other features or components.

Sizes of components in the drawings may be exaggerated for convenienceof explanation. In other words, since sizes and thicknesses ofcomponents in the drawings are arbitrarily illustrated for convenienceof explanation, the following exemplary embodiments are not limitedthereto.

In the following examples, the x-axis, the y-axis and the z-axis are notlimited to three axes of the rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

When an embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

Reference will now be made in detail to exemplary embodiments, examplesof which are illustrated in the accompanying drawings. Like referencenumerals in the drawings denote like elements, and thus repeateddescriptions thereof will be omitted. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. Expressions such as “at least one of,” when preceding alist of elements, modify the entire list of elements and do not modifythe individual elements of the list.

FIG. 1 is a front view of an organic light-emitting display apparatus100 according to an embodiment. FIG. 2 is a cross-sectional view inwhich an area A of FIG. 1 is enlarged. FIG. 3 is a cross-sectional viewof an organic light-emitting device 30 of FIG. 1.

Referring to FIGS. 1 to 3, the organic light-emitting display apparatus100 may include a first substrate 10, a second substrate 20, the organiclight-emitting device 30, and a sealant 50.

The first substrate 10 may be formed of transparent glass mainlyincluding SiO₂. The first substrate 10 is not limited thereto and mayalso be formed of a transparent plastic material. The plastic materialthat is used to form the first substrate 10 may be an insulating organicmaterial and may be an organic material selected from the groupconsisting of polyethersulfone (PES), polyacrylate, polyetherimide(PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyarylate (PAR), polyimide, polycarbonate(PC), cellulose triacetate (TAC), and cellulose acetate propionate(CAP).

In the case of a bottom-emission type apparatus where an image isembodied in a direction of the first substrate 10, the first substrate10 should be formed of a transparent material. However, in the case of atop-emission type apparatus where an image is embodied in an oppositedirection of the first substrate 10, the first substrate 10 does notnecessarily need to be formed of a transparent material. In this case, ametal may be used to form the first substrate 10. In the case that themetal is used to form the first substrate 10, the first substrate 10 mayinclude one or more selected from the group consisting of carbon (C),iron (Fe), chromium (Cr), manganese (Mn), nickel (Ni), titanium (Ti),molybdenum (Mo), stainless steel (SUS), an INVAR alloy, an INCONELalloy, and a KOVAR alloy; however, the first substrate 10 is not limitedthereto. The first substrate 10 may be formed of a metal foil.

The first substrate 10 on which the organic light-emitting device 30 isprovided is bonded to the second substrate 20 disposed above the organiclight-emitting device 30. Not only a glass substrate but also a plasticsubstrate such as an acrylic-substrate may be used for the secondsubstrate 20. Furthermore, a metal plate may also be used for the secondsubstrate 20.

The organic light-emitting device 30 may have a light-emitting unitformed on the first substrate 10. The light-emitting unit may include athin film transistor (TFT). Also, a passivation film 331 may be formedto cover the light-emitting unit and the TFT, and an organiclight-emitting device (OLED) 338 may be formed on the passivation film331.

A buffer layer 332 that is formed of an organic compound and/or aninorganic compound is further formed on a top surface of the firstsubstrate 10 and may be formed of SiOx (x≥1) or SiNx (x≥1). After anactive layer 333 arranged in a predetermined pattern is formed on thebuffer layer 332, the active layer 333 is covered by a gate insulatinglayer 334. The active layer 333 includes a source region 333 a and adrain region 333 c and further includes a channel region 333 b betweenthe source region 333 a and the drain region 333 c.

The active layer 333 may contain various materials. For example, theactive layer 333 may contain an inorganic semiconductor material such asamorphous silicon or crystalline silicon. In another example, the activelayer 333 may contain an oxide semiconductor. Alternatively, the activelayer 333 may contain an organic semiconductor material. Hereinafter, acase in which the active layer 333 is formed of amorphous silicon willbe mainly described in detail for convenience of description.

The active layer 333 may be formed by forming an amorphous silicon filmon the buffer layer 332, crystallizing the amorphous silicon film into apolycrystalline silicon film, and patterning the polycrystalline siliconfilm. The active layer 333 has the source region 333 a and the drainregion 333 c doped with impurities based on a type of the TFT, such as adriving TFT (not shown) or a switching TFT (not shown).

A gate electrode 335 corresponding to the active layer 333 and aninterlayer insulating layer 336 covering the gate electrode 335 areformed on a top surface of the gate insulating layer 334.

After contact holes are formed in the interlayer insulating layer 336and the gate insulating layer 334, a source electrode 337 a and a drainelectrode 337 b are formed on the interlayer insulating layer 336 so asto respectively contact the source region 333 a and the drain region 333c.

On an upper portion of the TFT formed as such, the passivation film 331is formed. On an upper portion of the passivation film 331, a pixelelectrode 338 a of the OLED 338 is formed. The pixel electrode 338 acontacts the drain electrode 337 b of the TFT via a via hole H2 formedin the passivation film 331. The passivation film 331 may be formed ofan inorganic material and/or an organic material as a single layer ortwo or more layers. The passivation film 331 may be formed as aplanarization film so as to planarize a top surface of the passivationfilm 331 regardless of an uneven portion of a film that is disposedunder the passivation film 331. On the contrary, the passivation film331 may be formed such that the top surface of the passivation film 331is uneven due to the uneven portion of the film that is disposed underthe passivation film 331. Also, the passivation film 331 may be formedof a transparent insulator to accomplish a resonance effect.

After the pixel electrode 338 a is formed on the passivation film 331, apixel defining film 339 is formed of an organic material and/or aninorganic material to cover the pixel electrode 338 a and thepassivation film 331, and an opening is formed in the pixel definingfilm 339 to expose the pixel electrode 338 a.

Also, an intermediate layer 338 b and an opposite electrode 338 c areformed at least on the pixel electrode 338 a.

Although the pixel electrode 338 a serves as an anode and the oppositeelectrode 338 c serves as a cathode, polarities of the pixel electrode338 a and the opposite electrode 338 c may be reversed. A firstelectrode may be any one of the pixel electrode 338 a and the oppositeelectrode 338 c, and a second electrode may be the other of the pixelelectrode 338 a and the opposite electrode 338 c.

The pixel electrode 338 a and the opposite electrode 338 c are insulatedfrom each another by the intermediate layer 338 b, and apply voltageshaving polarities different from each other to the intermediate layer338 b so that light is emitted by an organic emission layer.

The intermediate layer 338 b may include the organic emission layer.Alternatively, in addition to the organic emission layer, theintermediate layer 338 b may further include at least one of a holeinjection layer, a hole transport layer, an electron transport layer,and an electron injection layer. The present embodiment is not limitedthereto, and the intermediate layer 338 b may include the organicemission layer and may further include other various functional layers.

Meanwhile, a unit pixel includes a plurality of sub-pixels that may emitlights of various colors. For example, the sub-pixels may includesub-pixels that emit lights of red, green, and blue or sub-pixels thatemit lights of red, green, blue, and white.

The sub-pixels may include the intermediate layers 338 b having organicemission layers that emit lights of various colors. For example, thesub-pixels include the intermediate layers 338 b having organic emissionlayers that emit lights of red, green, and blue.

In another example, the sub-pixels that emit lights of various colorsmay include the intermediate layers 338 b having organic emission layersthat emit lights of the same color, for example, white, and may includea color converting layer that converts the white light into a light of apredetermined color or a color filter.

The intermediate layer 338 b emitting the white light may have a varietyof structures. For example, the intermediate layer 338 b may include astructure in which at least a light-emitting substance emitting a redlight, a light-emitting substance emitting a green light, and alight-emitting substance emitting a blue light are stacked on oneanother.

In another example of a structure for emitting the white light, theintermediate layer 338 b may include a structure in which at least alight-emitting substance emitting a red light, a light-emittingsubstance emitting a green light, and a light-emitting substanceemitting a blue light are mixed.

The red, green, and blue colors are exemplary, and the presentembodiment is not limited thereto. That is, any combination of othervarious colors, which is capable of emitting a white light, may beemployed in addition to a combination of red, green, and blue colors.

The sealant 50 may bond the first substrate 10 and the second substrate20 (FIG. 1). The sealant 50 may be formed such that at least a portionthereof is formed of an organic material 51 a and the other portion isformed of the organic material 51 a and an inorganic material 52 a. Thesealant 50 may have a intermixing region 52 formed by filling freevolume 51 b of the organic material 51 a with the inorganic material 52a. That is, the intermixing region 52 may be formed by using sequentialvapor infiltration (SVI) which will be described below.

The organic material 51 a may be formed of one or more materialsselected from the group consisting of an acrylate-based resin, amethacrylate-based resin, polyisoprene, a vinyl-based resin, anepoxy-based resin, a urethane-based resin, a cellulose-based resin, anda parylene-based resin.

The inorganic material 52 a may be formed of one or more materialsselected from the group consisting of silicon nitride, aluminum nitride,zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride,silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide,and silicon oxynitride (SiON).

The inorganic material 52 a may be formed as a source gas and a reactivegas react with each other. After the source gas is injected into thefree volume, a purge process is performed. The reactive gas is injectedafter the source gas permeates the free volume enough to form aintermixing region therein. The reactive gas reacts with the source gasinjected into the free volume to form an inorganic material. Thus, thereactive gas may react with the source gas to form the inorganicmaterial 52 a in the free volume.

The source gas may be applied to the SVI. Also, the source gas is a gasthat reacts with the reactive gas to form the inorganic material and isnot limited to a specific substance. For example,tetrakis(dimethylamino)silane (TDMAS), tetrakis(ethylmethylamino)silane(TEMASi), tris(ethylmethylamino)silane (Tris-EMAS),tris(dimethylamino)silane (Tris-DMAS), tetraethylorthosilicate (TEOS),bis(ethylmethylamino)silane (BEMAS), bis(diethylamino)silane (BDEAS),trimethylaluminum (TMA), tritertiarybutyl aluminum (TTBA),tetrakis(ethylmethylamino)zirconium (TEMAZr), titanium tetrachloride(TiCl₄), tetrakis(dimethylamido)titanium (TDMAT),tetrakis(ethylmethylamino)titanium (TEMAT),tetrakis(diethylamino)titanium (TDEAT), titanium tetraisopropoxide(TTIP), tert-butylimino tri(diethylamino)tantalum (TBTDET),tetrakis(ethylmethylamino)hafnium (TEMAHf), tertiary-butyl imidotris-ethylmethylamido tantalum (TBITEMATa), tert-butyliminotri(diethylamino)tantalum (TBTDET), pentaetoxytantalum (PET),bis(tetramethylheptadinato)strontium (Sr(tmhd)₂),tetrakis(ethylmethylamino)antimony (TEMASb) or the like may be used asthe source gas.

The reactive gas is a gas that reacts with the source gas to form theinorganic material and is not limited to a specific substance. Forexample, H₂O, O₃, NH₃, or the like may be used as the reactive gas.

Although the sealant 50 is disposed on the first substrate 10 and thesecond substrate 20 in FIG. 1, a position of the sealant 50 is notlimited thereto, and the sealant 50 may be formed on the passivationfilm 331 or the pixel defining film 339 (FIG. 3). However, hereinafter,a case in which the sealant 50 is disposed on the first substrate 10will be mainly described in detail for convenience of description.

The intermixing region 52 may block moisture or oxygen passing throughthe organic material 51 a and permeating the organic light-emittingdevice 30. External moisture or oxygen may pass through free volume ofan organic film. The intermixing region 52 is composed of the organicmaterial 51 a and the inorganic material 52 a filling the free volume ofthe organic material 51 a, and the inorganic material 52 a may blockpermeation of moisture or oxygen by blocking free volume of an organicfilm 51.

A thickness d1 of the intermixing region 52 may be less than a thicknessd2 of the organic film 51 formed by the organic material 51 a. Since theintermixing region 52 is formed as the source gas and the reactive gasforming the inorganic material 52 a spread through the free volume ofthe organic material 51 a, the thickness d1 of the intermixing region 52may be less than the thickness d2 of the organic film 51.

The intermixing region 52 may be formed on the outside of the sealant50. As the intermixing region 52 is formed to contact an outer portionof the sealant 50, the intermixing region 52 may prevent moisture oroxygen from passing through the sealant 50 and permeating the organiclight-emitting device 30.

A proportion of the inorganic material 52 a in the sealant 50 maydecrease in a direction from the outermost perimeter of the sealant 50to the inside of the sealant 50. A volume of the inorganic material 52 aper unit volume of the sealant 50 may decrease in a direction from theoutermost perimeter of the organic light-emitting display apparatus 100to the inside of the organic light-emitting display apparatus 100. Theinorganic material 52 a spreads from the outside of the organiclight-emitting display apparatus 100 to the inside of the organiclight-emitting display apparatus 100. At the outermost perimeter of thesealant 50, a source gas or a reactive gas for forming the inorganicmaterial 52 a may react easily and produce a large amount of a sourcegas inorganic material or a reactive gas inorganic material 52 a. As aspreading speed of the source gas and/or the reactive gas decreasestoward the inside of the sealant 50, an amount of the inorganic material52 a filling the free volume of the organic material 51 a decreases.

A frit, which is an inorganic material, may be used in an encapsulationprocess. Although the frit has similar properties to glass and thereforehas excellent moisture permeability, high-temperature laser should beirradiated for sealing. High-temperature heat may cause deformation of asubstrate or an organic light-emitting device, which may change thestress of a material. Accordingly, the frit is required to be spacedapart from an organic light-emitting material, which degrades thequality of a display product due to increase of the dead space.

A hybrid form in which an organic material and an inorganic material arecombined may be used in the encapsulation process. A sealant of thehybrid form may not effectively prevent permeation of moisture or oxygenbecause the sealant of the hybrid form includes separate films formed ofthe inorganic material and the organic material and the film formed ofthe inorganic material is cracked or damaged due to external shocks.

Since the inorganic material 52 a permeates the free volume of theorganic material 51 a after the sealant 50 is formed of the organicmaterial 51 a, the organic light-emitting display apparatus 100 may beeffectively protected from permeation of moisture or oxygen.

As the sealant 50 is formed by filling the free volume of the organicmaterial 51 a with the inorganic material 52 a, the inorganic material52 a is not broken. Thus, durability of the organic light-emittingdisplay apparatus 100 is improved.

As a proportion of the organic material 51 a in the sealant 50 is high,the first substrate 10 and the second substrate 20 may be encapsulatedby applying low-temperature heat thereto. That is, the sealant 50 may bedisposed in the organic light-emitting display apparatus 100 to reducethe dead space.

FIG. 4 is a front view of an organic light-emitting display apparatus200 according to another embodiment.

Referring to FIG. 4, the organic light-emitting display apparatus 200may include a first substrate 210, a second substrate 220, an organiclight-emitting device 230, a first sealant 240, and a second sealant250. Since the first substrate 210, the second substrate 220, and theorganic light-emitting device 230 are the same or substantially similarto the first substrate 10, the second substrate 20, and the organiclight-emitting device 30 respectively of the above-described organiclight-emitting display apparatus 100, a repeated description thereof isomitted for simplification.

At least one of the first sealant 240 and the second sealant 250 mayinclude a first intermixing region 242 and/or a second intermixingregion 252 formed such that an organic material is partially permeatedby an inorganic material. The first sealant 240 may have the firstintermixing region 242 formed by filling free volume of a first organicmaterial with a first inorganic material. The second sealant 250 mayhave the second intermixing region 252 formed by filling free volume ofa second organic material with a second inorganic material. That is, atleast one of the first intermixing region 242 and the second intermixingregion 252 may be formed by using SVI.

Each of the first organic material and the second organic material maybe formed of one or more materials selected from the group consisting ofan acrylate-based resin, a methacrylate-based resin, polyisoprene, avinyl-based resin, an epoxy-based resin, a urethane-based resin, acellulose-based resin, and a parylene-based resin.

Each of the first inorganic material and the second inorganic materialmay be formed of one or more materials selected from the groupconsisting of silicon nitride, aluminum nitride, zirconium nitride,titanium nitride, hafnium nitride, tantalum nitride, silicon oxide,aluminum oxide, titanium oxide, tin oxide, cerium oxide, and SiON.

The first intermixing region 242 and the second intermixing region 252may face the outside of the organic light-emitting display apparatus200. The organic light-emitting display apparatus 200 may include aplurality of intermixing regions, thereby effectively blockingpermeation of moisture or oxygen.

The first sealant 240 may seal the first substrate 210 and the secondsubstrate 220, and the first inorganic material may permeate the firstsealant 240 in a direction from the outside of the organiclight-emitting display apparatus 200 to the inside of the organiclight-emitting display apparatus 200. That is, a source gas is injectedin a direction from the outside of the first sealant 240 to the insideof the first sealant 240 and a reactive gas is injected thereafter toform the first inorganic material. Accordingly, the first intermixingregion 242 may be formed on the outside of the first sealant 240.

Next, the second sealant 250 may be disposed along the first sealant 240at the outside of the first sealant 240 to seal the first substrate 210and the second substrate 220. The second inorganic material may permeatethe second sealant 250 in a direction from the outside of the organiclight-emitting display apparatus 200 to the inside of the organiclight-emitting display apparatus 200. That is, a source gas is injectedin a direction from the outside of the second sealant 250 to the insideof the second sealant 250 and a reactive gas is injected thereafter toform the second inorganic material. Accordingly, the second intermixingregion 252 may be formed on the outside of the second sealant 250.

The second intermixing region 252 may block permeation of externalmoisture or oxygen in the front line. Also, the first intermixing region242 may prevent moisture or oxygen which has passed through the secondsealant 250 from permeating the organic light-emitting device 230.

The first intermixing region 242 may be formed toward the organiclight-emitting device 230, and the second intermixing region 252 may beformed toward a perimeter of the organic light-emitting displayapparatus 200. The second intermixing region 252 may be formed incontact with the outside so as to block permeation of external moistureor oxygen in the front line. The first intermixing region 242 mayprevent moisture or oxygen which has passed through the second sealant250 from permeating the organic light-emitting device 230. Also, thefirst intermixing region 242 may trap the moisture or oxygen which haspassed through the second sealant 250. As moisture or oxygen which haspermeated through the second intermixing region 252 is trapped in aspace between the first intermixing region 242 and the secondintermixing region 252, in free volume of a first organic film 241, orin free volume of a second organic film 251, the moisture or oxygen maybe prevented from permeating the organic light-emitting device 230.

FIG. 5 is a block diagram for describing a method of manufacturing thesealant 50 of FIG. 1. Referring to FIG. 5, a method of manufacturing theorganic light-emitting display apparatus 100 may be understood asfollows.

The first substrate 10 on which the organic light-emitting device 30 isformed is prepared, and the second substrate 20 is aligned with thefirst substrate 10 to bond the first substrate 10 and the secondsubstrate 20. The first substrate 10 and the second substrate 20 may bebonded by applying heat to the sealant 50 to encapsulate the organiclight-emitting display apparatus 100.

As a proportion of the organic material 51 a in the sealant 50 is high,the first substrate 10 and the second substrate 20 may be bonded atrelatively low temperatures. Thus, deformation of the organiclight-emitting device 30, the first substrate 10, or the secondsubstrate 20 due to heat may be reduced, and effectively an inactivespace may be reduced.

The sealant 50 may be manufactured by using SVI. The sealant 50 may bemanufactured as a sealant formed of the organic material 51 a isdisposed in a chamber (not shown) and the inorganic material 52 a in agaseous state is injected into the chamber and spreads through freevolume of the organic material 51.

Therefore, the sealant 50 formed of an organic material is disposed inthe chamber. In operation S10, a source gas which may react with areactive gas to form the inorganic material 52 a is injected into thechamber.

After a predetermined period of time, the source gas permeates freevolume of an organic material. Thus, in operation S20, if the source gasis kept in the chamber for a certain period of time, the source gasspreads through the free volume of the organic material.

A reactive gas is injected and reacts with the source gas to form theinorganic material 52 a. The source gas is purged, the reactive gas isinjected into the chamber, and the reactive gas is kept in the chamber.In operation S30, the reactive gas permeates the free volume of theorganic material due to diffusion, and the reactive gas may react withthe source gas to form an inorganic material.

As described above, according to some embodiments, an organiclight-emitting display apparatus and a method of manufacturing the samemay reduce permeation of moisture or oxygen through an organiclight-emitting device, thereby improving durability.

It should be understood that the exemplary embodiments described thereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each exemplaryembodiment should typically be considered as available for other similarfeatures or aspects in other exemplary embodiments.

While one or more exemplary embodiments have been described withreference to the figures, it will be understood by those of ordinaryskill in the art that various changes in form and details may be madetherein without departing from the spirit and scope of the presentdisclosure as defined by the following claims.

What is claimed is:
 1. A method of manufacturing a sealant, the methodcomprising: forming an organic-sealant on a first substrate; providing asource gas to a free volume of the organic-sealant; and providing areactive gas into the organic-sealant into which the source gas isintroduced, wherein an inorganic material is formed in the free volumeof the organic-sealant, by reacting the source gas and the reactive gas.2. The method of claim 1, wherein providing of the source gas isperformed in a chamber, and after a period of time, the source gas isspread in the free volume of the organic-sealant.
 3. The method of claim1, wherein providing of the reactive gas is performed after purging ofthe source gas.
 4. The method of claim 1, wherein the reactive gascomprises at least one of H₂O, O₃, and NH₃.
 5. The method of claim 1,the method further comprising: bonding the first substrate and a secondsubstrate facing the first substrate by the organic-sealant, wherein adevice is disposed on the first substrate, and the organic-sealantsurrounds the device.
 6. The method of claim 5, wherein a proportion ofthe inorganic material in the organic-sealant decreases in an areacloser to the device in a direction orthogonal to a stacking directionof the first substrate and the second substrate.
 7. The method of claim5, wherein the first substrate and the second substrate are bonded byapplying heat to the organic-sealant.